BS EN 61188-5-8-2008 印制电路板和印制电路板组件.设计和使用.焊接(焊接区/焊缝)要求.区域阵列组件(BGA、FBGA、CGA、LGA)
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【英文标准名称】:Printedboardsandprintedboardassemblies—Designanduse—Part5-8:Attachment(land/joint)considerations—Areaarraycomponents(BGA,FBGA,CGA,LGA)
【原文标准名称】:印制电路板和印制电路板组件.设计和使用.焊接(焊接区/焊缝)要求.区域阵列组件(BGA、FBGA、CGA、LGA)
【标准号】:BSEN61188-5-8-2008
【标准状态】:现行
【国别】:英国
【发布日期】:2008-05-30
【实施或试行日期】:2008-05-30
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:应用;组装件;芯片;元部件;设计;显影;尺寸;分立器件;电气工程;电子工程;电子设备;电子设备及元件;架设(施工作业);扁平接触表面;制造;包装件;印制电路板;耐力;表面安装设备;软钎焊连接;规范(验收);结构体系;辅助框架;表面安装;表面安装装置
【英文主题词】:Applications;Assemblies;Chips;Components;Design;Developments;Dimensions;Discretedevices;Electricalengineering;Electronicengineering;Electronicequipment;Electronicequipmentandcomponents;Erecting(constructionoperation);Flatcontactsurfaces;Manufacturing;Packages;Printed-circuitboards;Resistance;SMD;Solderedjoints;Specification(approval);Structuralsystems;Subracks;Surfacemounting;Surfacemountingdevices
【摘要】:ThispartofIEC61188providesinformationonlandpatterngeometriesusedforthesurfaceattachmentofelectroniccomponentswithareaarrayterminationsintheformofsolderballs,soldercolumnsorprotectivecoatedlands.Theintentoftheinformationpresentedhereinistoprovidetheappropriatesize,shapeandtolerancesofsurfacemountlandpatternstoensuresufficientareafortheappropriatesolderjoint,andalsoallowforinspection,testingandreworkingofthosesolderjoints.Eachclausecontainsaspecificsetofcriteriasuchthattheinformationpresentedisconsistent,providinginformationonthecomponent,thecomponentdimensions,thesolderjointdesignandthelandpatterndimensions.Thelandpatterndimensionsarebasedonamathematicalmodelthatestablishesaplatformforasolderjointattachmenttotheprintedboard.Theexistingmodelscreateaplatformthatiscapableofestablishingareliablesolderjointnomatterwhichsolderalloyisusedtomakethatjoint(lead-free,tinlead,etc.).Processrequirementsforsolderreflowaredifferentdependingonthesolderalloyandshouldbeanalyzedsothattheprocessistakingplaceabovetheliquidustemperatureofthealloy,andremainsabovethattemperatureasufficienttimetoformareliablemetallurgicalbond.Areaarraylandpatternsdonotuse"landprotrusion"conceptsandattempttomatchthecharacteristicsofthephysicalanddimensionalterminationproperties.Thereareseveralconfigurationsavailable,asshowninFigure1.However,thetablesprovidedshowonlytheoptimumdimensionacrosstheouterconstructionoftheland.
【中国标准分类号】:L30
【国际标准分类号】:31_180
【页数】:34P.;A4
【正文语种】:英语
【原文标准名称】:印制电路板和印制电路板组件.设计和使用.焊接(焊接区/焊缝)要求.区域阵列组件(BGA、FBGA、CGA、LGA)
【标准号】:BSEN61188-5-8-2008
【标准状态】:现行
【国别】:英国
【发布日期】:2008-05-30
【实施或试行日期】:2008-05-30
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:应用;组装件;芯片;元部件;设计;显影;尺寸;分立器件;电气工程;电子工程;电子设备;电子设备及元件;架设(施工作业);扁平接触表面;制造;包装件;印制电路板;耐力;表面安装设备;软钎焊连接;规范(验收);结构体系;辅助框架;表面安装;表面安装装置
【英文主题词】:Applications;Assemblies;Chips;Components;Design;Developments;Dimensions;Discretedevices;Electricalengineering;Electronicengineering;Electronicequipment;Electronicequipmentandcomponents;Erecting(constructionoperation);Flatcontactsurfaces;Manufacturing;Packages;Printed-circuitboards;Resistance;SMD;Solderedjoints;Specification(approval);Structuralsystems;Subracks;Surfacemounting;Surfacemountingdevices
【摘要】:ThispartofIEC61188providesinformationonlandpatterngeometriesusedforthesurfaceattachmentofelectroniccomponentswithareaarrayterminationsintheformofsolderballs,soldercolumnsorprotectivecoatedlands.Theintentoftheinformationpresentedhereinistoprovidetheappropriatesize,shapeandtolerancesofsurfacemountlandpatternstoensuresufficientareafortheappropriatesolderjoint,andalsoallowforinspection,testingandreworkingofthosesolderjoints.Eachclausecontainsaspecificsetofcriteriasuchthattheinformationpresentedisconsistent,providinginformationonthecomponent,thecomponentdimensions,thesolderjointdesignandthelandpatterndimensions.Thelandpatterndimensionsarebasedonamathematicalmodelthatestablishesaplatformforasolderjointattachmenttotheprintedboard.Theexistingmodelscreateaplatformthatiscapableofestablishingareliablesolderjointnomatterwhichsolderalloyisusedtomakethatjoint(lead-free,tinlead,etc.).Processrequirementsforsolderreflowaredifferentdependingonthesolderalloyandshouldbeanalyzedsothattheprocessistakingplaceabovetheliquidustemperatureofthealloy,andremainsabovethattemperatureasufficienttimetoformareliablemetallurgicalbond.Areaarraylandpatternsdonotuse"landprotrusion"conceptsandattempttomatchthecharacteristicsofthephysicalanddimensionalterminationproperties.Thereareseveralconfigurationsavailable,asshowninFigure1.However,thetablesprovidedshowonlytheoptimumdimensionacrosstheouterconstructionoftheland.
【中国标准分类号】:L30
【国际标准分类号】:31_180
【页数】:34P.;A4
【正文语种】:英语
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